Next-Gen Mobile Chipsets From Qualcomm And Huawei Get Detailed



Next-Gen Mobile Chipsets From Qualcomm And Huawei Get Detailed

The image reveals that Snapdragon 845 will feature four unannounced ARM Cortex-A75 cores and four Cortex-A53 cores, while the Kirin 970 will stick with Cortex-A73 and Cortex-A53 cores. Both will support UFS 2.1 storage, LPDDR4X RAM and Cat. 18 LTE.
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